We have the ability to replace BGA IC's ranging from 0.020" x 0.010" (0.51mm x 0.25mm) to 1.4" x 1.4" (35mm x 35mm).  We can accomodate boards up to 15" x 9" (381mm x 229 mm) and a maximum thickness of 0.25" (6mm).  Each BGA IC has it's own temperature profile, ie.: temperature ramp so to eliminate thermal shock but still maintain temperature for lead-free solder to flow. Once designed these profiles are always used for a particular BGA IC.   This means every time the BGA IC is removed or replaced its always the same temperature at the same moment in time.  The Metcal APR-5000 uses an optic system which allows the operator to view the bottom of the IC and the top of the board simultaneously, resulting in a perfect placement of the BGA IC every time.